Product Overview
We provide high-end custom manufacturing services for ceramic printed circuit boards, using high-end ceramic substrates including high-purity alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4) and zirconia (ZrO2), specially designed for extreme application scenarios with high power, high voltage, high temperature and high reliability requirements. Our products have industry-leading thermal conductivity, ultra-high electrical insulation, extremely low coefficient of thermal expansion and excellent high temperature stability, perfectly adapting to extreme working condition requirements that cannot be met by traditional organic PCBs and metal core PCBs. They are the core supporting solutions for high-end power electronics, medical, aerospace equipment, supporting full types of ceramic PCB process customization including thick film, thin film, DPC and LAM.
Key Specifications
Substrate types: full series of ceramic substrates including 96%/99% alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4) and zirconia (ZrO2)
Layer count: conventional 1-2 layer single-sided and double-sided solutions, up to 8 layers of multi-layer ceramic PCB design available
Board thickness range: 0.25mm to 2.0mm, with special thickness solutions available on demand
Thermal conductivity range: 20W/m·K to 230W/m·K, accurately matched according to substrate type, with aluminum nitride substrates up to 230W/m·K
Minimum trace/space: stable mass production at 2/2mil, with higher precision solutions available on demand
Operating temperature range: -55℃ to 850℃, adapting to extreme high temperature application scenarios
Breakdown voltage: up to 15kV/mm, with extremely strong high voltage insulation performance
Surface finish options: full coverage of ENIG, immersion gold, OSP and thick film gold plating
Lead time: as fast as 24 hours for rapid prototyping orders, customizable lead time for mass production orders
Compliance standards: strictly follow IPC Class 2/3 standards, meet RoHS environmental requirements, adapting to medical, automotive and aerospace application specifications
Process support: supporting metallized holes, edge plating, cavity structure, step board and other special process customization
Core Advantages
1.Ultimate thermal conductivity: the thermal conductivity of ceramic substrates can reach up to 230W/m·K, more than 100 times that of traditional FR4 PCBs, which can extremely quickly conduct the heat generated by power devices, fundamentally solving the problems of heat accumulation and thermal runaway, and greatly improving the service life and operation stability of power devices
2.Ultra-high insulation performance: with excellent electrical insulation, it can withstand ultra-high voltage impact, perfectly adapting to high-voltage power electronic application scenarios, greatly reducing the risk of product leakage and breakdown, and is an ideal supporting substrate for IGBT and power semiconductor modules
3.Perfect thermal matching: the coefficient of thermal expansion (CTE) is highly matched with silicon chips and semiconductor power devices, which can greatly reduce thermal stress during temperature cycles, avoid solder joint cracking and device desoldering failure, and significantly improve the reliability of products in extreme temperature fluctuation environments
4.Excellent environmental stability: with extremely strong high temperature resistance, low temperature resistance, chemical corrosion resistance, aging resistance and radiation resistance, it can operate stably for a long time in extreme high temperature, corrosion and radiation environments where organic substrates cannot withstand, without aging, deformation or performance degradation
5.Full-process customized services: we provide full-process services including substrate selection, process solution customization, thermal simulation optimization and free DFM review according to product application scenarios and performance requirements, adapting to customized needs of different industries such as medical, aerospace, automotive and industry, with no minimum order quantity limitation, supporting small-batch R&D prototyping
Quality Control
We have established an exclusive quality control process for ceramic PCBs, from full inspection of purity, thermal conductivity, coefficient of thermal expansion and density of incoming substrates, to line precision, coating bonding force and metallized hole quality control during production, to 100% open/short circuit test, insulation withstand voltage test, thermal shock test, microsection analysis and adhesion test of finished products before delivery. We control product performance and quality throughout the whole process to ensure every product meets the strict requirements of extreme application scenarios.
Application
High-power semiconductor modules, IGBT heat dissipation substrates, medical imaging and diagnostic equipment, aerospace airborne systems, automotive power electronics, high-power LED lighting, industrial high temperature sensors, new energy vehicle power modules, high temperature industrial control equipment, defense military electronic systems, laser equipment, etc.
