
Overview
Aging Testing is an accelerated life verification process for high-reliability PCBA products, executed according to customer requirements after the functional test is passed. It places the finished PCBA in a simulated harsh operating environment with rated load, high temperature, and temperature cycling, and runs the product continuously for a specified period, to verify the long-term operation reliability of the product. This accelerated aging test can identify potential early failure risks of components and solder joints, and ensure that the product can maintain stable performance during its full service life in harsh operating environments. All Aging Testing operations strictly follow IPC-9701, IPC-TM-650 international standards.
Accelerated Life Test Principle
The test uses environmental stress acceleration methods including thermal stress, electrical stress, and mechanical stress, to accelerate the potential failure process of the product
The test parameters are set based on the product's service life requirements and application scenarios, with a clear acceleration factor
The test fully simulates the long-term operating state of the product, to identify early failure defects that cannot be detected by conventional functional tests
The test process does not cause permanent damage to qualified products, and will not affect the normal service life of the product
The test standards are formulated according to IPC international standards and customer product reliability requirements
Customized Test Condition Setting
Test duration can be customized from 24 hours to 1000 hours, according to the product reliability requirements
Test temperature can be set from normal temperature to 125℃, with high and low temperature cycle test available
Rated operating load and over-load test conditions can be set according to the product design parameters
Power on and off cycle test conditions can be customized, to simulate the actual on-off operation of the product
Humidity environment can be controlled, to simulate high-humidity application scenarios
Vibration stress test can be added as an optional service, to simulate the mechanical stress environment of automotive and industrial products
Full-Process Operating Status Monitoring
The product is kept in continuous operating state during the entire test process, with full functional operation
Key operating parameters of the product are monitored and recorded in real time, including power supply voltage, current, power consumption, and signal parameters
Functional integrity test is executed regularly during the aging process, to verify the stability of the product function
Abnormal state of the product is monitored in real time, with automatic alarm and record for fault events
The test environment parameters are monitored and recorded in real time, to ensure the stability of the test conditions
Early Failure Risk Identification
The test can identify early failure defects of components, including weak components and defective components
Potential solder joint reliability risks, including cold solder and insufficient solder defects, can be identified through the aging process
Potential design defects of the product, including unreasonable power supply design and thermal design, can be identified through long-term operation
Batch consistency problems of the product can be identified through batch aging test data analysis
All identified defects and risks are recorded in the aging test report, with optimization suggestions provided
Post-Test Performance Verification
Full functional test and electrical performance test are executed for all products after the aging test
Appearance and solder joint quality inspection is completed after the aging test, to verify the structural stability of the product
Performance parameters before and after the aging test are compared and analyzed, to verify the performance stability of the product
Products that pass the post-aging test are marked and archived, with the aging test report bound to the product batch
Aging test reports are archived for each batch, with a retention period of not less than 3 years, and can be provided to customers upon request