Overview
With over 15 years of specialized experience in domestic PCBA assembly, we provide full turnkey electronic manufacturing services from PCB fabrication, component sourcing, assembly, testing, to final box build. Our assembly facility is equipped with fully automated SMT production lines, advanced inspection equipment, and professional engineering team. We serve global customers across consumer electronics, industrial control, automotive electronics, medical devices, telecommunication, and aerospace industries. All assembly processes strictly follow IPC-A-610 international standards, with ISO9001, IATF16949, ISO13485 certifications.
Assembly Type Capability
Full turnkey PCBA assembly (PCB fabrication + component sourcing + assembly + testing)
Consigned PCBA assembly (customer provides PCB and components, we provide assembly service)
Partial consigned PCBA assembly
SMT only assembly
Through-hole (THT) only assembly
Mixed technology assembly (SMT + through-hole)
Double-sided SMT assembly
Rigid PCB assembly
Flexible PCB (FPC) assembly
Rigid-flex PCB assembly
Prototype assembly (5 pieces minimum)
Low to medium volume assembly
High volume mass production assembly
SMT Assembly Capability
Minimum component size: 01005 package (0.4mm × 0.2mm)
Minimum fine pitch: 0.3mm lead spacing for QFP, SOP components
Component package support: 01005, 0201, 0402, 0603, 0805, 1206, SOP, QFP, TQFP, QFN, LGA, BGA, CSP, COB, and connector
Placement accuracy: ±0.025mm for chip components; ±0.015mm for IC components
Maximum board size: 500mm × 1200mm
Minimum board thickness: 0.2mm
Maximum board thickness: 6.0mm
High-speed placement capacity: up to 150,000 components per hour per production line
Number of SMT feeders: up to 120 feeders per line
Through-Hole Assembly Capability
Automatic and manual through-hole component insertion
Wave soldering for mass production through-hole assembly
Selective soldering for complex through-hole components
Manual soldering for prototype and low volume orders
Through-hole component lead forming
Connector assembly including press-fit connectors
Maximum board size for wave soldering: 450mm × 1200mm
Minimum through hole diameter: 0.3mm
Support for axial, radial, DIP, TO, and connector packages
Component Sourcing Capability
Global component sourcing from authorized distributors and original manufacturers
Component types: active components, passive components, electromechanical components, connectors, and custom parts
Supported manufacturers: TI, ADI, ST, NXP, Microchip, Murata, TDK, Yageo, AVX, TE, Molex, and over 2000 other global manufacturers
Component alternative recommendation for long lead time and obsolete parts
Component authenticity verification and quality inspection
Component batch traceability management
Inventory management for consigned components
BOM optimization for cost reduction and supply chain stability
Testing and Inspection Capability
3D Solder Paste Inspection (SPI)
Automated Optical Inspection (AOI) pre and post reflow
2D and 3D X-Ray Inspection for hidden solder joints
In-Circuit Testing (ICT) with custom fixture
Flying Probe Testing for prototype and low volume orders
Functional Testing (FCT) with custom test fixture
Embedded System Testing and firmware programming
Aging Testing under controlled temperature and load
Thermal cycle testing
Humidity testing
Vibration testing
Conformal coating inspection
Final visual inspection by certified IPC specialists
Special Process Capability
BGA reballing and rework
Fine-pitch component rework
Through-hole component rework
Conformal coating including acrylic, silicone, polyurethane, and epoxy
PCB cleaning including ultrasonic cleaning and aqueous cleaning
Hot bar soldering for flexible PCB and fine-pitch connectors
Wire bonding for COB components
Potting and encapsulation
Labeling and serial number marking with laser or inkjet
Box build assembly including enclosure, wiring, and final test
