Overview
Online AOI (Automated Optical Inspection) Testing is our core automated in-process quality control method, running through the entire PCB bare board fabrication and PCBA assembly process. It uses a high-resolution optical imaging system and intelligent image comparison algorithm to inspect product defects that are difficult to identify with manual visual inspection, with 100% full inspection coverage for all critical production nodes. This process eliminates human visual inspection errors, intercepts defects at the earliest production stage, and ensures the consistency of each production panel. All AOI testing operations strictly follow IPC-A-600, IPC-A-610 international standards.
Automated Inspection Mechanism
A high-precision industrial camera imaging system is used to capture high-definition images of the product surface
An intelligent algorithm compares the captured images with the standard design file, to automatically identify deviations and defects
Inspection parameters are set according to IPC standards and customer requirements, with adjustable defect judgment thresholds
All inspection operations are fully automated, without manual intervention in the defect identification process
Defect images and coordinate data are automatically recorded and archived, with full traceability
Bare Board Inspection Scope
Open circuit and short circuit defects of copper traces
Trace width deviation and line edge roughness defects
Copper residue and foreign matter on the board surface
Solder mask misalignment, missing, and bubble defects
Pad damage, deformation, and missing defects
Silkscreen print misalignment, missing, and blurring defects
Drill hole position deviation and hole wall damage defects
Assembled Board Inspection Scope
Component missing, wrong placement, and polarity reversal defects
Solder paste bridging, insufficient solder, and cold solder defects
Component offset and tilt defects beyond the standard range
Pin deformation and damage defects of connector components
Foreign matter and residue on the assembled board surface
Solder mask and silkscreen damage caused by the assembly process
Real-Time Defect Feedback System
Defect data is synchronized to the production line and engineering team in real time
Critical defects will trigger an immediate production line pause, to prevent the flow of non-conforming products
Defect type, quantity, and location are statistically analyzed in real time, to identify process fluctuations
The engineering team adjusts process parameters in real time based on defect feedback, to reduce the continuous generation of similar defects
Defect disposal results are recorded and synchronized to the system, forming a closed-loop management
Inspection Accuracy Calibration Protocol
The AOI equipment is calibrated with a standard calibration board before each production shift
Inspection accuracy is verified with a standard defect board every day, to ensure the stability of the identification capability
Algorithm parameters are optimized continuously based on mass production defect data, to reduce false detection and missed detection rates
The equipment is maintained and calibrated regularly by professional technicians, with complete calibration records archived
The inspection accuracy is subject to regular spot checks by the quality control team, with unqualified results triggering a full re-inspection of the products produced in the period
