Product Overview
We specialize in custom manufacturing of flexible printed circuit boards (FPC), using high-performance polyimide (PI) and polyester (PET) flexible substrates, covering 1 to 8 layers of designs from rapid prototyping to volume production. Our flexible PCBs feature excellent bending performance, ultra-thin thickness, light weight and three-dimensional wiring capability, can be freely bent, folded and twisted, and maintain stable electrical performance after tens of thousands of bending cycles. Strictly manufactured in accordance with IPC international standards, they are the ideal solution for miniaturized, lightweight and dynamic bending electronic designs, widely used in wearable devices, medical equipment, automotive electronics and other fields.
Key Specifications
Layer count: 1 to 8 layers, supporting single-sided, double-sided, multi-layer flexible PCB and rigid-flex PCB designs
Substrate options: polyimide (PI), polyester (PET), adhesive/adhesiveless substrate, with stiffener, EMI shielding options available
Board thickness range: 0.05mm to 0.8mm for single/double-sided FPC, 0.2mm to 2.0mm for multi-layer FPC
Finished copper weight: 0.5oz to 3oz, adapting to different circuit design requirements
Minimum trace/space: stable mass production at 3/3mil, with higher precision solutions available on demand
Minimum bending radius: customized according to design requirements, supporting dynamic and static bending applications
Surface finish options: ENIG, immersion gold, immersion silver, OSP, electro-gilding full coverage
Lead time: efficient prototyping service available, mass production lead time customizable according to project needs
MOQ rule: no minimum order quantity limitation, supporting small-batch prototyping and volume production
Compliance standards: strictly follow IPC Class 2/3 standards, certified by UL, RoHS and REACH
Process support: stiffener bonding, EMI shielding, coverlay opening, contour cutting, bending forming and other special processes
Core Advantages
1.Excellent bending performance: can be freely bent, folded and twisted, maintains stable electrical performance after long-term repeated bending, perfectly adapting to dynamic bending and three-dimensional wiring design requirements
2.Ultra-light and thin design: greatly reduces the volume and weight of electronic products, perfectly matching the miniaturization and lightweight design needs of smart devices
3.Stable electrical performance: excellent high-frequency and high-speed transmission performance, low dielectric loss, stable impedance characteristics, suitable for high-speed signal transmission designs
4.Mature processing technology: rich experience in complex multi-layer FPC manufacturing, with stable coverlay lamination, hole metallization and surface treatment quality, ensuring long-term bending reliability
5.Wide application adaptability: supports customized designs for static and dynamic bending scenarios, and provides full-process technical support including material selection, bending life optimization and DFM review
Quality Control
We have established a dedicated quality control system for flexible PCBs, from IQC full inspection of incoming substrate flexibility, peel strength and dielectric properties, to first article confirmation, IPQC tour inspection during production, to 100% finished product inspection before delivery including AOI, continuity and open circuit test, bending resistance test, impedance verification and solderability test. This ensures every FPC meets design requirements and long-term use reliability.
Application
Wearable smart devices, medical diagnostic and treatment equipment, automotive electronics, foldable consumer electronics, laptop and tablet computers, camera modules, aerospace and defense equipment, industrial sensors, etc.
