Product Overview
We provide full-custom multilayer PCB manufacturing services, covering 2 to 64 layers of designs from rapid prototyping to large-scale volume production, with core technologies including high-precision layer alignment, blind and buried vias, back drilling, resin plug hole and impedance control. Designed for high-integration, high-speed and high-reliability electronic designs, our multilayer PCBs effectively improve component layout density, reduce product size, optimize signal transmission paths, and deliver excellent signal integrity and anti-interference performance. Strictly manufactured in accordance with IPC international standards, they are the core solution for high-complexity electronic designs in communication, industrial control, medical, automotive and aerospace industries.
Key Specifications
Layer count: 2 to 64 layers, supporting conventional multi-layer, high-layer count, blind and buried via, HDI and back drilling designs
Board thickness range: 0.4mm to 6.0mm, with board thickness tolerance of ±5%
Finished copper weight: 0.5oz to 20oz, supporting different copper thickness designs for inner and outer layers
Minimum trace/space: down to 2/2mil, stable mass production at 4/4mil for conventional multi-layer designs
Layer alignment accuracy: ±0.5mil, ensuring high-precision interlayer connection for high-layer count boards
Impedance control tolerance: ±5%, full-process control of single-ended, differential and coplanar impedance consistency
Surface finish options: ENIG, lead-free HASL, immersion silver, immersion gold, OSP, hard gold plating full coverage
Lead time: efficient prototyping service available, mass production lead time fully customizable according to project complexity
MOQ rule: no minimum order quantity limitation, supporting orders from 5pcs prototypes to volume production
Compliance standards: strictly follow IPC Class 2/3 standards, certified by UL, RoHS and REACH
Material options: standard FR4, High TG FR4, Rogers, high-speed low-loss materials, supporting hybrid stack-up of different materials
Core Advantages
1.High integration capability: effectively improves component layout density, reduces PCB size and product volume, perfectly adapting to the miniaturization design requirements of high-complexity electronic products
2.Excellent signal integrity: optimizes signal transmission paths, reduces transmission loss and crosstalk, and ensures stable signal transmission for high-speed digital and analog circuit designs
3.Mature high-layer count manufacturing technology: rich experience in 20+ layer high-complexity PCB production, with stable layer alignment, interlayer bonding and hole metallization quality, and a mass production yield of over 99%
4.Full-process technical support: our in-house engineering team provides stack-up design optimization, impedance calculation, free DFM review and other full-process services, maximizing design performance and optimizing manufacturing costs
5.Flexible order adaptation: seamlessly accepts all types of orders from R&D prototypes, small-batch trial production to scaled mass production, with consistent quality control standards for all order sizes
Quality Control
We have established an exclusive quality control process for multilayer PCBs, from IQC full inspection of incoming substrate consistency, to inner layer AOI inspection, layer alignment confirmation, lamination parameter real-time monitoring during production, to 100% finished product inspection before delivery including outer layer AOI, flying probe test, impedance verification, continuity and open circuit test, thermal stress test and microsection analysis. We control product quality throughout the whole process to ensure every multilayer PCB meets design requirements and IPC standards.
Application
Communication base station equipment, server and data center systems, industrial automation control devices, automotive electronics, medical diagnostic equipment, aerospace electronic systems, high-speed test and measurement instruments, new energy BMS systems, high-end consumer electronics, etc.
