Core Service Introduction
Our professional BGA Reballing service provides precision repair and restoration solutions for BGA, micro-BGA, and CSP components. It restores full functionality to damaged, de-soldered, or recycled integrated circuits. Advanced rework equipment and specialized stencil-based reballing techniques are used to replace missing or damaged solder balls with factory-specification solder alloys, enabling reliable reattachment of BGA components to PCB. Full BGA repair, rework, and component recycling services are available.
Core Capabilities
We support BGA reballing for all mainstream package types and sizes, from miniature micro-BGA and fine-pitch BGA to large-scale processor BGA, GPU, FPGA, memory controller, and SoC packages. Both lead-free and leaded solder ball alloys are supported to match original component specifications.
Technical Advantages
Precision Reballing Process: Custom precision stencils matched to BGA package footprint are used for consistent solder ball placement and sizing, ensuring uniform ball height and alignment across the entire array. The process includes controlled component removal, pad cleaning and preparation, solder ball placement, reflow, and post-reballing inspection, delivering factory-equivalent solder joint reliability.
Comprehensive Rework: Full BGA rework services are provided, including precision component removal from PCB, damaged pad repair and reconstruction, trace restoration, underfill removal and reapplication, and post-rework assembly and testing. Component recovery and reballing for recycled chips from decommissioned boards are supported to reduce material costs.
Non-Damaging Control: Infrared and hot-air rework stations feature programmable temperature profiling, ensuring controlled heating and cooling throughout the reballing process, preventing thermal damage to the component die and substrate.
Quality Assurance
Every reballed BGA component undergoes rigorous quality verification, including high-magnification visual inspection of solder ball alignment, uniformity, and integrity, followed by X-ray inspection to verify ball size consistency and absence of voids or bridging. Optional electrical functionality testing is provided to confirm component integrity after reballing.
Compliance
Our BGA reballing and rework processes fully comply with IPC-7711/7721 rework and repair standards. Certified technicians and documented process controls ensure consistent, reliable results across every component. All materials used are RoHS-compliant, with full traceability of solder alloys and consumables.
Traceability
Full process records are retained for every BGA reballing project, including component part numbers, solder alloy specifications, temperature profiles, and inspection reports, supporting full quality tracking for high-reliability applications.
Typical Application Fields
Our BGA Reballing services are widely used for PCB repair and rework across industries, including motherboard and graphics card repair, industrial control system maintenance, medical device repair, automotive ECU rework, telecommunications equipment maintenance, prototype R&D rework, and component recovery for cost optimization, supporting both single-unit repair and batch reballing for production rework.
