Product Overview
We specialize in custom manufacturing of high glass transition temperature (High TG) printed circuit boards, using well-known global brand high TG epoxy resin substrates covering full grade specifications from TG 140℃to 220℃. They are specially designed for lead-free soldering processes, long-term high-temperature operation and high-reliability electronic applications. Our High TG PCBs have excellent thermal stability, dimensional consistency, chemical resistance and moisture resistance, which can greatly reduce the risk of board deformation, delamination and blowout under high temperature environments. They are the preferred substrate solution for high-temperature working conditions and high-reliability electronic equipment, perfectly adapting to the strict process requirements of multiple lead-free reflow soldering cycles.
Key Specifications
Layer count: 1 to 32 layers, compatible with single-sided, double-sided, multi-layer, blind and buried via full structure designs, supporting rigid-flex and heavy copper composite processes
TG value grades: standard Tg 140℃, medium Tg 150℃, high Tg 170℃, 180℃ conventional grades, with ultra-high temperature resistance grade solutions up to 220℃ available
Board thickness range: 0.4mm to 6.0mm, with board thickness tolerance of ±5%
Finished copper weight: 1oz to 20oz, adapting to conventional signal layer and high-current power layer design requirements
Minimum trace/space: stable mass production at 3/3mil, with higher precision solutions available on demand
Impedance control tolerance: ±5%, full-process control of impedance consistency
Surface finish options: ENIG, lead-free HASL, immersion silver, OSP and hard gold plating are all available
Lead time: as fast as 48 hours for rapid prototyping orders, customizable lead time for mass production orders
Compliance standards: strictly follow IPC Class 2/3 standards, certified by UL, RoHS and REACH, adapting to automotive, medical and industrial application requirements
Material options: covering well-known domestic and international high TG substrate brands including Shengyi, ITEQ and Isola, supporting halogen-free, flame retardant and high CTI special substrate customization
Core Advantages
1.Excellent thermal stability: maintains stable physical properties under high temperature environments, greatly reduces the risk of board deformation, delamination and blowout during lead-free reflow soldering (peak 260℃), improves soldering yield, and can withstand multiple high-temperature reflow cycles without performance degradation
2.Low coefficient of thermal expansion: the CTE of the substrate is highly matched with semiconductor chips, which can greatly reduce thermal stress during temperature cycles, reduce the risk of solder joint fatigue failure, and significantly extend the service life of the product
3.Excellent environmental tolerance: has extremely strong chemical resistance, moisture resistance and aging resistance, and can maintain stable electrical performance for a long time in harsh industrial environments with humidity, corrosion and high and low temperature cycles
4.Full-scenario process compatibility: perfectly adapts to all types of post-assembly processes including lead-free soldering, selective wave soldering and conformal coating, and is compatible with composite process requirements such as blind and buried vias, impedance control, heavy copper and rigid-flex
5.Free technical empowerment: our in-house engineering team provides free DFM review, substrate selection guidance and stack-up design optimization, can customize exclusive high TG solutions according to product application scenarios, and provides 24/7 all-weather technical support to respond to needs at any time
Quality Control
We have established a full-chain quality control management system, from IQC full inspection of incoming substrates, to first article inspection, IPQC tour inspection and real-time furnace temperature monitoring during the production process, to 100% open/short circuit test, impedance verification, thermal stress test, microsection analysis and flame resistance test of finished products before delivery. We control product quality throughout the whole process to ensure that every batch of products meets design and standard requirements.
Application
Automotive electronic control units, industrial power supply systems, communication base station equipment, aerospace airborne equipment, high-power frequency converters, new energy battery management systems (BMS), high-temperature industrial control equipment, high-end security products, automotive lighting modules, etc.
