Overview
We specialize in high-precision BGA (Ball Grid Array) assembly services, with over 15 years of experience in fine-pitch BGA, micro BGA, CSP, and other array package assembly. Our assembly facility is equipped with high-precision placement machines, nitrogen reflow ovens, and high-resolution X-Ray inspection systems, to ensure reliable BGA assembly quality. All BGA assembly processes strictly follow IPC-A-610 international standards, with defect rate below 100 PPM for mass production orders. We support BGA assembly for prototype orders starting from 5 pieces, up to full-scale volume production.
BGA Package Type Capability
Standard plastic BGA (PBGA)
Ceramic BGA (CBGA)
Micro BGA (μBGA)
Chip Scale Package (CSP)
Fine-pitch BGA with minimum ball pitch 0.25mm
Ultra-fine pitch BGA down to 0.2mm ball pitch
Large BGA with maximum size 50mm × 50mm
BGA with up to 2000 I/O pins
Stacked BGA package
PoP (Package on Package) assembly
QFN, LGA, and other array packages
BGA Assembly Precision Capability
Minimum BGA ball pitch: 0.2mm
Maximum BGA size: 50mm × 50mm
Placement accuracy: ±0.015mm for BGA components
Placement rotation accuracy: ±0.05 degree
Reflow temperature control accuracy: ±1℃
X-Ray inspection resolution: 5μm
Void detection accuracy: down to 1% of ball size
Maximum board thickness for BGA assembly: 6.0mm
Minimum board thickness for BGA assembly: 0.4mm
BGA Assembly Process Capability
BGA design review and DFM optimization
BGA stencil design and fabrication with customized aperture design
Solder paste printing with automatic screen printer and 3D SPI inspection
High-precision BGA placement with vision alignment system
Nitrogen reflow soldering with customized temperature curve
100% X-Ray inspection for BGA solder joint quality
BGA reballing service for damaged or reused components
BGA rework service with professional BGA rework station
BGA reliability testing including thermal cycle and aging test
BGA Quality Control and Inspection Capability
Pre-assembly BGA component incoming inspection including ball coplanarity, dimension, and authenticity
Stencil design verification and first print inspection
First Article Inspection (FAI) after BGA placement
100% 3D Solder Paste Inspection (SPI) before placement
Real-time reflow temperature curve monitoring and recording
100% high-resolution X-Ray inspection for every BGA component
X-Ray inspection items: solder void, cold solder, solder bridge, missing ball, ball alignment, and solder wetting
Void acceptance standard: IPC Class 2 (void area <25% per ball) for standard applications; IPC Class 3 (void area <15% per ball) for high-reliability applications
Post-assembly electrical testing and functional testing
Microsection analysis for BGA solder joint quality verification (sample test)
BGA Design Support Capability
BGA footprint design review and optimization
Via in pad design support with resin filled via process
Via near pad design support with solder mask tented via
BGA escape routing design review
Impedance control design verification for BGA high-speed signals
Power distribution network (PDN) design review for BGA power supply
Thermal relief design review for BGA thermal pad
Solder mask and paste mask design optimization
Stencil aperture design recommendation for different BGA packages
IPC standard compliance review for BGA design
BGA Application Support
Consumer electronics BGA assembly
Industrial control system BGA assembly
Automotive electronics BGA assembly
Medical device BGA assembly
Telecommunication equipment BGA assembly
Aerospace and defense BGA assembly
High-speed digital system BGA assembly
High-frequency RF system BGA assembly
