With a strict zero-defect quality management system built in full compliance with IPC-A-600, IPC-A-610 and ISO9001 international standards, we have established a closed-loop quality control system covering the entire production lifecycle from design input to finished product shipment. All testing protocols are implemented with automated inspection equipment to eliminate human error and ensure batch-to-batch consistency. We mandate 100% full inspection for all critical testing items, with zero tolerance for non-conforming products.
1.Pre-Production Quality Control
This stage focuses on eliminating design risks and verifying process feasibility before production starts, to avoid batch defects and rework.
1.1 Design Rule Check (DRC)
We perform mandatory Design Rule Check for every customer’s Gerber and design files before production, using industry-leading EDA software to conduct a comprehensive inspection of all design parameters. The inspection covers trace width/space, annular ring size, drill hole diameter, layer stack-up, impedance design, solder mask clearance, and panelization design, to identify potential manufacturability risks, electrical performance defects, and assembly compatibility issues in advance. Our engineering team will provide professional optimization suggestions for non-conforming designs, to ensure the design fully matches our production capabilities and achieves the best yield and performance.
1.2 First Article Inspection (FAI)
For every new batch, new design, or adjusted process, we strictly implement First Article Inspection before full-scale mass production. We fabricate and assemble the first production panel according to the final design and process parameters, and conduct a full-item inspection covering all dimensional parameters, electrical performance, material properties, and process quality. The FAI report includes traceable data of all critical production steps, and mass production will only start after the first article is fully qualified and signed off by our certified QA team and the customer (if required). This protocol eliminates batch quality risks caused by design changes, process adjustments, or material replacement.
2.In-Process Production Quality Control
This stage runs through every critical step of PCB fabrication and SMT assembly, with real-time monitoring and inspection to ensure each process meets quality standards, and non-conforming products will not flow into the next process.
2.1Online AOI Testing
We perform 100% Online AOI Testing for all inner and outer layers after the etching process, and post-SMT assembly, using industry-leading automated optical inspection equipment. For bare boards, AOI testing inspects for trace short/open circuits, trace width deviation, copper residue, solder mask misalignment, and pad defects; for assembled boards, it inspects for component missing, wrong placement, polarity reversal, solder bridging, and insufficient solder. This fully automated inspection eliminates human visual inspection errors, achieves 100% full coverage of all circuit and assembly defects, and ensures the consistency of each production panel.
2.2 X-Ray Testing
We conduct X-Ray Testing for multilayer PCBs, HDI boards, and assembled boards with BGA, QFN, and other hidden solder joint components, using high-resolution X-ray inspection equipment. For bare multilayer boards, X-ray testing verifies layer-to-layer alignment accuracy, plated through-hole integrity, blind/buried via filling quality, and inner layer trace defects; for assembled boards, it inspects the quality of hidden solder joints that cannot be detected by AOI, including solder voids, cold solder, solder bridging, and BGA ball alignment. This testing ensures the reliability of interlayer connections and hidden solder joints, which are critical for high-complexity PCB designs.
2.3 Solder Paste Inspection (SPI)
For all SMT assembly orders, we implement 100% Solder Paste Inspection before component placement, using 3D automated SPI equipment. This testing inspects the volume, height, area, alignment, and shape of the solder paste printed on the PCB pads, to identify defects such as insufficient solder paste, excessive solder paste, solder paste bridging, misalignment, and missing print. As solder paste printing quality accounts for over 70% of SMT assembly defects, this pre-placement inspection eliminates assembly risks at the source, improves soldering yield, and ensures the long-term reliability of solder joints.
3.Post-Fabrication & Final Shipment Quality Control
This stage focuses on verifying the final electrical performance, functional reliability, and long-term operation stability of the finished PCB/PCBA, ensuring only fully qualified products are shipped to customers.
3.1 Electronic Testing
We perform 100% Electronic Testing for every bare PCB before shipment, including two core testing methods: flying probe testing for prototype and small-batch orders, and fixture-based testing for mass production orders. This testing conducts a full continuity and isolation inspection of all circuits, to identify open circuits, short circuits, insulation resistance defects, and electrical performance deviations. For impedance-controlled boards, we also conduct 100% TDR impedance testing to verify the impedance value meets the design tolerance requirements. This testing ensures the bare board fully meets the design's electrical performance specifications.
3.2 In-Circuit Testing (ICT)
For assembled PCBA orders, we conduct In-Circuit Testing using professional ICT fixtures, which is a power-on electrical inspection of the assembled board. This testing verifies the correct placement of components, component value deviation, missing/wrong components, polarity reversal, solder short/open circuits, and other assembly defects, by testing the electrical characteristics of each node on the board. ICT can quickly locate assembly defects at the component level, ensuring the hardware of the assembled board is fully consistent with the design BOM and schematic.
3.3 Functional Testing (FCT)
After ICT is passed, we conduct Functional Testing (FCT) for the assembled PCBA according to the customer's product functional specifications. We simulate the actual operating environment of the product, power on the board, and conduct a comprehensive test of all functional modules, including power output, signal transmission, interface communication, sensor response, and logic control functions. This testing verifies whether the assembled PCBA can achieve the designed functional performance in the actual operating state, ensuring the product meets the end-use requirements.
3.4 Embedded System Testing
For PCBA with embedded systems, firmware, or programmable chips, we conduct specialized Embedded System Testing after FCT. This testing includes firmware programming verification, system boot-up test, program operation stability test, data storage and read-write test, communication protocol interaction test, and peripheral driver compatibility test. We simulate the actual operating scenarios of the embedded system to verify the stable operation of the software and hardware integration, and ensure the embedded system can fully execute the designed functions without crashes, data loss, or communication failures.
3.5 Aging Testing
For high-reliability application orders (automotive, industrial control, medical, aerospace), we conduct optional Aging Testing according to customer requirements. We place the finished PCBA in a simulated operating environment with rated load, high temperature, and temperature cycling, and run the product continuously for a specified period (from 24 hours to 1000 hours). This accelerated aging test verifies the long-term operation reliability of the product, identifies potential early failure risks of components and solder joints, and ensures the product can maintain stable performance during its full service life in harsh operating environments.
