Product Overview
We specialize in providing fully customized manufacturing services for Rogers substrate PCBs, with nearly 20 years of in-depth experience in Rogers high frequency material processing technology, perfectly adapting to the processing requirements of the full series of Rogers substrates. We deliver high-performance and high-reliability PCB solutions for RF, microwave, millimeter wave and high-speed high-frequency applications. Our products have ultra-low transmission loss, ultra-stable dielectric properties and excellent environmental tolerance, making them the preferred substrate solution for high-end high-frequency electronic systems. They perfectly match the strict performance requirements of 5G communication, automotive radar, aerospace and other scenarios, supporting hybrid design of Rogers with FR4, PTFE and metal core substrates, balancing performance and manufacturing cost.
Key Specifications
Layer count: 1 to 24 layers, supporting hybrid stack-up design of Rogers substrates with FR4, aluminum base and PTFE substrates, balancing performance and cost
Material coverage: full series of Rogers high frequency substrates, including mainstream models such as RO4003C, RO4350B, RO5880, RO3003, RO3010, RO4835, RO3203, RO4533
Minimum trace/space: stable mass production at 3/3mil, with higher precision solutions available on demand
Minimum metallized hole diameter: as low as 0.2mm, adapting to high frequency miniaturization design requirements
Impedance control tolerance: ±5%, full-process control of high frequency line impedance consistency
Finished copper weight: 0.5oz to 10oz, adapting to different RF circuit design requirements
Board thickness range: 0.25mm to 3.0mm, with board thickness tolerance of ±5%
Surface finish options: ENIG, immersion gold, immersion silver, OSP and hard gold plating, prioritizing high frequency low loss process solutions
Lead time: as fast as 5 working days for prototype orders, customizable lead time for mass production orders
Compliance standards: strictly follow IPC Class 2/3 standards, meet RoHS and UL environmental and safety requirements, adapting to aerospace, automotive and communication grade application specifications
Process support: supporting blind and buried vias, via-in-pad, resin plug hole, impedance control, back drilling and other composite processes
Core Advantages
1.Ultimate high frequency performance: Rogers substrates have an ultra-low dielectric loss factor (Df), maintain a stable dielectric constant (Dk) over an ultra-wide frequency range above 100GHz, greatly reduce signal attenuation and insertion loss, ensure the stability and accuracy of high frequency signal transmission, perfectly adapting to high-end applications such as 5G millimeter wave and 77GHz automotive radar
2.Excellent environmental stability: with excellent temperature resistance, moisture resistance and chemical corrosion resistance, it can maintain stable physical and electrical properties in a wide temperature range from -55℃ to 150℃, perfectly adapting to harsh working conditions such as aerospace, automotive and outdoor industrial scenarios
3.Mature processing technology: with nearly 20 years of Rogers substrate processing experience, we solve the industry pain points of Rogers substrates such as easy deformation, easy moisture absorption, difficult etching precision control and poor lamination bonding force, with a stable mass production yield of over 99%, and can support supporting assembly of 01005 packages and 0.4mm pitch BGA
4.Full-process technical empowerment: our in-house professional high frequency engineering team provides Rogers substrate selection guidance, hybrid stack-up design optimization, impedance calculation, DFM manufacturability review and signal integrity simulation full-process services, maximizing design performance while optimizing manufacturing costs, with thousands of successful project experiences in RF & microwave, base station antenna and automotive radar fields
5.Flexible order adaptation: no minimum order quantity limitation, we can accept all types of orders from 5pcs R&D prototypes to scaled mass production, apply the same quality control and service standards to small-batch and large-volume orders, and synchronously support one-stop full-chain services including PCBA assembly, component procurement, X-ray inspection and functional testing
Quality Control
We have established an exclusive quality control process for Rogers products, from original factory genuine verification, full Dk/Df parameter inspection and batch traceability of incoming substrates, to line precision control, double confirmation of impedance first article and real-time monitoring of lamination parameters during production, to 100% open/short circuit test, full impedance inspection, AOI optical inspection, X-ray inspection and microsection analysis of finished products before delivery. We control product performance and quality throughout the whole process to ensure every product meets design requirements.
Application
5G/6G base station equipment, millimeter wave communication systems, automotive 77GHz anti-collision radar, aerospace and defense radar systems, satellite communication terminals, high-speed test and measurement instruments, RF power amplifiers, base station antenna arrays, microwave RF modules, autonomous driving millimeter wave radar, etc.
