Product Overview
We provide full-custom rigid-flex printed circuit board manufacturing services, which organically combine rigid PCB and flexible PCB into a single integrated structure, covering 2 to 32 rigid layers with 1 to 8 flexible layers. Our rigid-flex PCBs inherit the stable mechanical support performance of rigid boards and the excellent bending performance of flexible boards, effectively solve the interconnection challenges of complex three-dimensional assemblies, reduce assembly solder joints, improve product reliability, and reduce product volume and weight. Strictly manufactured in accordance with IPC international standards, they are the preferred high-reliability solution for medical, aerospace, automotive and high-end consumer electronics with complex three-dimensional space limitations.
Key Specifications
Layer count: 2 to 32 rigid layers, 1 to 8 flexible layers, supporting blind and buried vias, via-in-pad and HDI designs
Substrate options: rigid layer uses FR4/High TG FR4, flexible layer uses PI substrate, supporting stiffener and EMI shielding design
Board thickness range: 0.4mm to 6.0mm for rigid area, 0.1mm to 0.8mm for flexible area
Finished copper weight: 0.5oz to 10oz for rigid layer, 0.5oz to 3oz for flexible layer
Minimum trace/space: stable mass production at 3/3mil, with higher precision solutions available on demand
Impedance control tolerance: ±5%, supporting impedance control for both rigid and flexible areas
Minimum bending radius: customized according to dynamic/static bending design requirements
Surface finish options: ENIG, immersion gold, immersion silver, OSP, hard gold plating full coverage
Lead time: customized lead time according to design complexity, efficient prototyping service available
MOQ rule: no minimum order quantity limitation, supporting small-batch prototyping and volume production
Compliance standards: strictly follow IPC Class 2/3 standards, certified by UL, RoHS and REACH
Process support: resin plug hole, back drilling, stiffener bonding, coverlay opening, contour cutting and other composite processes
Core Advantages
1.Three-dimensional interconnection capability: realizes free wiring in three-dimensional space, perfectly adapts to complex product shell structures, and maximizes the use of limited internal space of products
2.High reliability: reduces a large number of cable connectors and solder joints, eliminates the risk of poor contact caused by vibration and bending, and greatly improves the long-term operation stability of products
3.Lightweight and miniaturized design: replaces traditional rigid board + cable assembly scheme, effectively reduces product volume and weight, and adapts to the lightweight design needs of high-end electronic products
4.Mature complex manufacturing technology: rich experience in rigid-flex PCB production, with stable layer alignment, rigid-flex transition area processing and lamination technology, ensuring the reliability of bending areas and interlayer connections
5.Full-process technical support: our in-house engineering team provides stack-up design optimization, bending life evaluation, impedance calculation and free DFM review, providing customized solutions according to different application scenarios
Quality Control
We have established an exclusive quality control system for rigid-flex PCBs, from IQC full inspection of incoming rigid and flexible substrate matching performance, to inner layer AOI inspection, rigid-flex transition area process control, lamination parameter monitoring during production, to 100% finished product inspection before delivery including AOI, flying probe test, impedance verification, bending resistance test, thermal stress test and microsection analysis. We control product quality throughout the whole process to ensure every rigid-flex PCB meets design requirements and long-term reliability standards.
Application
Medical implant and diagnostic equipment, aerospace and defense electronic systems, automotive electronics, foldable smart devices, wearable equipment, camera modules, industrial control equipment, satellite communication terminals, etc.
