Product Overview
We provide a full range of custom manufacturing services for metal core printed circuit boards, covering all types of substrates including aluminum base, copper base, iron base and copper core, specially designed for thermal management requirements of high-power and high-heat electronic equipment. Our products use a high thermal conductivity insulating dielectric layer between the metal substrate and the copper circuit layer, with a heat dissipation efficiency 5-10 times that of traditional FR4 PCBs. It can quickly conduct and diffuse the heat generated by power devices, effectively reducing the operating temperature of components and extending the service life of products. It is the preferred heat dissipation solution for high-heat electronic equipment, supporting single-sided, double-sided, multi-layer metal core, and metal core hybrid with FR4 designs.
Key Specifications
Substrate types: aluminum base, copper base, iron base, copper core, supporting single-sided, double-sided, multi-layer metal core designs, compatible with metal core + FR4 hybrid solutions
Layer count: 1 to 6 layers, 24-hour rapid prototyping available for conventional single-sided and double-sided solutions
Thermal conductivity range: 1W/m·K to 12W/m·K, with ultra-high thermal conductivity grade customized solutions available, supporting automotive special thermal conductive substrates above 3W/m·K
Board thickness range: 0.4mm to 4.0mm, with metal substrate thickness options from 0.8mm to 3.0mm
Finished copper weight: 1oz to 15oz, adapting to different current carrying and heat dissipation requirements
Minimum trace/space: stable mass production at 3/3mil, with higher precision solutions available on demand
Surface finish options: ENIG, lead-free HASL, OSP, immersion silver and hard gold plating are all available
Lead time: as fast as 24 hours for rapid prototyping orders, customizable lead time for mass production orders
Compliance standards: strictly follow IPC Class 2/3 standards, certified by UL, RoHS and REACH, adapting to application specifications for automotive lighting, industrial power supplies and high-power LEDs
Insulation breakdown voltage: up to 5kV and above, ensuring electrical safety in high-voltage application scenarios
Core Advantages
1.Ultimate heat dissipation efficiency: the combination of high thermal conductivity insulating dielectric layer + metal substrate can quickly export the heat generated by components, with heat dissipation efficiency far exceeding traditional FR4 PCBs, fundamentally solving the product heat accumulation and thermal failure problems, and can reduce the operating temperature of components by 15-30℃
2.Excellent dimensional stability: the thermal expansion coefficient of metal substrate is much lower than that of organic substrates, with minimal deformation under temperature fluctuation environments, which can greatly reduce the thermal stress of solder joints, improve the soldering reliability and long-term operation stability of products
3.Flexible solution customization: we can customize substrate type, thermal conductivity, copper thickness and board thickness according to product heat dissipation requirements and application scenarios, provide full-process services including thermal simulation analysis, stack-up design optimization and free DFM review, adapting to special structural designs such as flat, boss and copper inlay
4.Full process compatibility: perfectly adapts to all types of assembly processes including SMT mounting, lead-free soldering, wave soldering and selective soldering, and is compatible with composite design requirements such as impedance control, heavy copper, surface mount and BGA packaging
5.High cost-performance advantage: compared with ceramic and other special heat dissipation PCB solutions, metal core PCB has better cost advantage, can realize automated mass production with shorter lead time, adapts to the full cycle demand from prototype to mass production, with no minimum order quantity limitation, starting from 5pcs
Quality Control
We have established a full-process quality control system for metal core products, from full inspection of thermal conductivity, peel strength, breakdown voltage and thermal resistance of incoming substrates, to line precision control, dielectric layer bonding management and etching uniformity detection during production, to 100% open/short circuit test, AOI optical inspection, thermal stress test, insulation withstand voltage test and adhesion test of finished products before delivery. We ensure every product meets heat dissipation and electrical performance requirements.
Application
High-power LED lighting, automotive LED headlights, power supply modules, motor drive controllers, photovoltaic inverters, new energy charging piles, industrial control equipment, consumer electronics heat dissipation modules, power semiconductor heat dissipation substrates, automotive electronic heat dissipation components, etc.
