Product Overview
With nearly 20 years of in-depth experience in high frequency PCB manufacturing, we have mature high frequency material processing technology and design optimization capabilities, providing fully customized high frequency PCB solutions for RF, microwave, millimeter wave and high-speed digital circuit applications. Our products use industry mainstream high frequency substrates, can support operating frequencies up to 110GHz, have ultra-low transmission loss, stable dielectric properties and excellent signal integrity, perfectly adapting to the strict performance requirements of high-end wireless communication, radar detection and other high frequency electronic systems. We provide full-process services from material selection, design simulation to production manufacturing and assembly testing.
Key Specifications
Layer count: 1 to 24 layers, supporting hybrid stack-up design of high frequency substrates with FR4 and metal core substrates, balancing performance and cost
Minimum trace/space: stable mass production at 2/2mil, with higher precision solutions available on demand
Impedance control tolerance: ±5%, full-process control of high frequency line impedance consistency
Minimum metallized hole diameter: as low as 0.2mm, adapting to high frequency miniaturization design requirements
Finished copper weight: 0.5oz to 10oz, adapting to different RF circuit design requirements
Board thickness range: 0.2mm to 6.0mm, with board thickness tolerance of ±5%
Material options: covering PTFE-based composite materials, modified PPO, high frequency FR4, as well as full series of imported high frequency substrates including Rogers, Arlon, Isola, Taconic, Teflon and DuPont, supporting domestic alternative high frequency substrate customization
Surface finish options: ENIG, immersion silver, immersion gold, OSP and hard gold plating, prioritizing high frequency low loss process solutions
Lead time: as fast as 5 working days for prototype orders, customizable lead time for mass production orders
Compliance standards: strictly follow IPC Class 2/3 standards, meet RoHS and UL environmental and safety requirements, adapting to aerospace and automotive application specifications
Process support: supporting blind and buried vias, via-in-pad, resin plug hole, impedance control, back drilling and other composite processes
Core Advantages
1.Ultra-low transmission loss: the substrate has an ultra-low dielectric loss factor (Df), maintains a stable dielectric constant (Dk) over a wide frequency and temperature range, greatly reduces signal attenuation and phase distortion, ensures the stability of high frequency signal transmission, and supports high-end applications such as 77GHz automotive radar and 110GHz millimeter wave communication
2.Precision process control: with mature high frequency substrate processing technology, we can accurately control line size, impedance tolerance and dielectric layer thickness, solve the industry pain points of high frequency substrates such as easy deformation, easy moisture absorption and high processing difficulty, with a stable mass production yield of over 99%
3.Full-process technical support: our in-house professional engineering team specializing in high frequency design provides substrate selection guidance, hybrid stack-up design optimization, impedance calculation, DFM manufacturability review, signal integrity simulation and thermal simulation full-process services, maximizing design performance, with rich project experience in RF & microwave, high-speed digital and 5G communication fields
4.Complete testing capabilities: equipped with professional testing equipment such as TDR impedance tester and network analyzer, we can complete full types of testing including high frequency performance verification, full impedance inspection, open/short circuit test and microsection analysis to ensure product performance meets the standards
5.Flexible order adaptation: no minimum order quantity limitation, we can accept all types of orders from 5pcs R&D prototypes to scaled mass production, apply the same quality control and service standards to small-batch orders, and synchronously support one-stop SMT assembly, BGA soldering, X-ray inspection and functional testing services
Quality Control
We have established an exclusive quality control process for high frequency products, from full verification of Dk/Df parameters and original factory traceability of incoming substrates, to line precision control, double confirmation of impedance first article and real-time monitoring of lamination parameters during production, to 100% open/short circuit test, full impedance inspection, AOI optical inspection and X-ray inspection of finished products before delivery. We control product performance and quality throughout the whole process to ensure every product meets design requirements.
Application
5G/6G millimeter wave communication systems, radar and navigation equipment, satellite communication terminals, RF/microwave transceivers, automotive 77GHz anti-collision radar, aerospace and defense military systems, high-speed test and measurement instruments, broadcast television transmission equipment, base station antenna arrays, etc.
