Product Overview
We specialize in custom manufacturing of heavy copper printed circuit boards dedicated to high-current and high-power scenarios, with finished copper weight covering the full range from 2oz to 20oz, specially designed for high-current carrying and efficient thermal management requirements of high-power electronic systems. Our products perfectly solve the heat dissipation and high-current transmission challenges of high-power equipment, have extremely strong impact resistance, aging resistance and thermal deformation resistance, and can operate stably for a long time under harsh industrial working conditions. They are the core supporting solutions for high-power electronic equipment, supporting full types of custom designs including full heavy copper inner layers, uniform heavy copper inner and outer layers, and local heavy copper.
Key Specifications
Layer count: 1 to 32 layers, supporting full heavy copper design for inner and outer layers, compatible with composite structure of heavy copper + conventional lines, composite process of heavy copper + high TG substrate
Finished copper weight: 2oz to 20oz, with special solutions for higher copper weight available, stable mass production of 5.5oz to 13oz heavy copper process
Board thickness range: 1.0mm to 6.0mm, adapting to special requirements of ultra-thick boards
Minimum trace/space: stable mass production of heavy copper lines at 10/10mil, with higher precision solutions available on demand
Aspect ratio of metallized holes: up to 20:1, ensuring the reliability of hole metallization of heavy copper boards, eliminating the risk of hole copper fracture and delamination
Surface finish options: full coverage of ENIG, lead-free HASL, immersion silver, OSP and hard gold plating
Lead time: as fast as 7 working days for prototype orders, customizable lead time for mass production orders
Compliance standards: strictly follow IPC Class 2/3 standards, certified by UL and RoHS, adapting to industrial, automotive and new energy application requirements
Material options: covering high TG FR4, metal core, ceramic filled high thermal conductivity substrates, supporting halogen-free flame retardant and high CTI special substrate customization
Core Advantages
1.Superb current carrying capacity: can carry tens to hundreds of amperes of high current, replacing the traditional bulky copper bar solution, greatly reducing product volume and weight, simplifying system structure design, perfectly adapting to high-power scenarios such as new energy and industrial power supplies
2.Ultimate heat dissipation performance: heavy copper lines can quickly conduct and diffuse the heat generated by power devices, effectively reducing the operating temperature of components, reducing the risk of thermal failure, significantly improving the long-term operation reliability of products, and achieving the best heat dissipation effect with thermal simulation optimization
3.Excellent mechanical properties: with extremely strong impact resistance, vibration resistance and thermal deformation resistance, it can perfectly adapt to harsh working conditions such as industrial, automotive and new energy scenarios, greatly extending the service life of products
4.Mature process capability: with mature heavy copper line etching, high aspect ratio hole metallization, lamination bonding and edge plating processes, we solve the industry pain points of uneven etching, lamination delamination and hole copper fracture of heavy copper boards, with a stable mass production yield of over 99%
5.Customized solution support: we provide full-process customized services including substrate selection, stack-up design, copper thickness distribution and thermal simulation optimization according to product power and heat dissipation requirements, complete free DFM manufacturability review, and a 24/7 technical team follows up the project throughout the whole process
Quality Control
We have established an exclusive quality control process for heavy copper products, from full inspection of copper thickness, TG value and peel strength of incoming substrates, to first article confirmation of etching line width, lamination parameter control and hole copper thickness detection during production, to 100% open/short circuit test, thermal stress test, microsection analysis, insulation withstand voltage test and current carrying capacity verification of finished products before delivery. We control product quality throughout the whole process to ensure every batch of products meets the requirements of high-current and high-power applications.
Application
Industrial power supply controllers, photovoltaic inverters, wind energy converters, battery management systems (BMS), automotive power modules, aerospace power supply systems, motor drives, welding equipment, high-power LED drive power supplies, new energy charging piles, UPS uninterruptible power supplies, etc.
