Product Overview
We provide full-stack custom manufacturing solutions for high-density interconnect PCBs, covering the entire lifecycle from R&D prototyping to scaled mass production. Leveraging industry-leading core technologies including laser micro-via, blind and buried vias, any-layer interconnect and via-in-pad, we deliver miniaturized, highly reliable and high-performance PCB solutions for highly integrated electronic designs. Our HDI PCBs perfectly adapt to high-density wiring and high-integration packaging requirements, solving the miniaturization and high signal integrity challenges that cannot be addressed by traditional PCBs. They are the core supporting products for high-end smart electronic devices, supporting full design requirements from 1st-order entry-level to 3rd-order and above high-end HDI.
Key Specifications
Layer count: 4 to 64 layers, supporting 3rd-order and above high-end HDI stack-up designs, compatible with 1-32 layer conventional HDI solutions, enabling mass production of 24-layer and above communication-grade HDI
Minimum laser micro-via diameter: as low as 0.1mm, minimum annular ring of 3.5mil, supporting resin plug hole and electroplating filling process
Minimum trace/space: down to 2.8/5.2mil, stable mass production at 4/4mil, with special designs achievable at 2/2mil
Finished copper weight: 0.5oz to 10oz, adapting to different current carrying and design requirements
Board thickness range: 0.4mm to 6.0mm, with board thickness tolerance of ±5%
Impedance control tolerance: ±5%, supporting full types of single-ended, differential and coplanar impedance control
Surface finish options: full coverage of ENIG, lead-free HASL, immersion silver, immersion gold, OSP and hard gold plating
Lead time: as fast as 7 working days for prototype orders, customizable lead time for mass production orders, with 24-hour expedited prototyping available
MOQ rule: no minimum order quantity limitation, supporting prototyping starting from 5pcs, seamlessly connecting to volume production
Material options: covering well-known domestic and international high-frequency/high-speed material brands including KB, Shengyi, Rogers and Isola, supporting hybrid design of FR4 and special materials
Core Advantages
1.Ultimate integration capability: significantly increases component layout density, reduces the finished PCB size, perfectly adapts to the miniaturization and thinning design requirements of smart terminals, and supports ultra-complex wiring design of up to 64 layers and 150,000+ pins
2.Excellent signal performance: effectively shortens the signal transmission path, reduces transmission loss and crosstalk, significantly improves the signal integrity of high-speed digital circuits, and adapts to high-frequency, high-speed and miniaturized SIP packaging design scenarios
3.Full-process technical empowerment: our in-house professional engineering team provides one-on-one design support, completes more than 150 free DFM/DFA manufacturability checks, avoids design risks in advance, optimizes mass production yield and cost, and and provides professional DFM review to optimize production efficiency and reliability
4.Flexible mass production adaptation: seamlessly accepts all types of orders from R&D prototypes, small-to-medium batch trial production to scaled mass production. Our production bases in China ensure delivery flexibility, and we apply the same quality control and service priority to both small-batch and large-volume orders
5.One-stop supporting services: synchronously supports full-chain services including component procurement, SMT/DIP assembly, X-ray/BGA inspection, functional testing and finished product shipping, realizing one-stop delivery from design to finished product, supporting both full Turnkey managed mode and customer consigned assembly mode
Quality Control
All products undergo strict full-process inspection before delivery, including 100% automated optical inspection (AOI), 3D solder paste inspection (SPI), X-ray inspection, flying probe test, fixture test, impedance analysis, continuity and open circuit verification, microsection analysis, and high-voltage insulation test. This ensures that every product meets IPC Class 2/3 standards, with a stable yield rate of over 99.8%.
Application
5G/6G communication terminals, wearable smart devices, IoT smart terminals, medical precision diagnostic equipment, automotive ADAS systems, industrial automation control modules, laptops, tablets, high-end consumer electronics and other highly integrated electronic devices.
