For wireless communication and RF microwave products, we deliver high-performance, high-consistency professional PCB & PCBA manufacturing solutions, built on RayPCB’s core high-frequency RF PCB manufacturing technology and PCBSync’s full-cycle wireless product service experience. With deep expertise in high-frequency high-speed signal integrity design, RF PCB manufacturing, and precision assembly, we fully cover full-scenario wireless communication application needs.
Application Scenarios
5G/6G communication equipment, WiFi 6/7 wireless routers and gateways, base station RF units, antenna arrays
Bluetooth/Wi-Fi/Zigbee wireless terminals, satellite communication equipment, microwave transmission equipment, wireless sensor nodes
Broadcast transmission equipment, wireless walkie-talkies, Radio Frequency Identification (RFID) equipment, automotive millimeter wave radar
Wireless product manufacturing needs from MHz to 110GHz full frequency band
Custom Capabilities
Rich industry experience in high-frequency RF PCB manufacturing, with mature processing technology for full series of Rogers, Taconic, Arlon, and PTFE high-frequency low-loss substrates
Support for hybrid laminated structures, any-layer interconnection HDI, blind and buried vias, via-in-pad, and resin plug hole processes, to optimize RF signal transmission performance and reduce signal loss and VSWR
Customized production support for 1-48 layer high-frequency boards, rigid-flex RF boards, with minimum trace/space down to 2/2mil and impedance control tolerance stably within ±5%, perfectly meeting the design requirements of various wireless RF products
High-precision mounting support for ultra-fine pitch BGA, QFN, RF-specific chips, SAW filters, antenna switches and other components, with advanced vacuum reflow soldering and nitrogen-protected soldering processes, with strict welding process parameter control to ensure the consistency and stability of RF solder joints
Quality Assurance
Exclusive quality control system for wireless RF products, with full-dimensional strict inspection for every product before delivery, including 100% SPI solder paste inspection, AOI, full X-ray inspection of all BGA components, impedance analysis, dedicated RF performance testing with network analyzer, and full-function verification
Customizable RF performance testing, environmental reliability testing, long-term burn-in testing and other special verifications available on demand, ensuring product performance stability in various deployment environments
Full production strictly following IPC international standards, with UL and RoHS certified products to meet global market access requirements
Value-Added Services
One-stop full-process services for wireless product customers, covering RF PCB design optimization, DFM analysis, impedance matching optimization, global procurement of RF-specific components, rapid prototyping (as fast as 5 days for high-frequency boards), large-scale mass production and other full-cycle services
1-on-1 full-process technical support from professional RF engineering team, including RF material selection suggestions, DFA analysis, and EMC/SI signal integrity simulation verification, to optimize product design and improve core product performance
